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Thermal Considerations
The thermal performance specified for modules in this manual requires a
clearance of 5.1cm (2 in) above and below the modules and 2.54cm (1 in) on
each side of the modules as shown below, regardless of the orientation of the
DIN rail.
2.54cm
(1.0in)
Mounting Modules on a Vertical DIN Rail
When using a vertical DIN rail, the CPU or NIU module must be installed at the
bottom.
Some VersaMax I/O modules require thermal derating. The section, Thermal
Derating, provides module-specific derating information. Mounting a module on
a vertical DIN rail increases the ambient temperature around each module, due
to the cumulative effect of the rising heat. Therefore, modules that have a
thermal derating when mounted on a horizontal DIN rail will have a greater
derating when mounted on a vertical DIN rail
Modules that do not have a thermal derating when mounted on a horizontal DIN
rail also have no derating when installed on a vertical DIN rail.
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VersaMax Modules, Power Supplies and Carriers User's Manual
5.1cm
(2.0in)
5.1cm
(2.0in)
5.1cm
(2.0in)
CPU or NIU
at Bottom
2.54cm
(1.0in)
2.54cm
(1.0in)
2.54cm
(1.0in)
GFK-1504N
5.1cm
(2.0in)
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