Thermal Rules - Lenovo ThinkSystem SR665 V3 User Manual

Thermal rules

This topic provides thermal rules for the server.
• "Typical configurations" on page 59
• "Storage configurations" on page 60
• "GPU configuration" on page 60
Abbreviations used in tables below are defined as follows:
• Max.Temp.: Maximum ambient temperature at sea level
• FIO = riser 5 + front OCP
• S/S: SAS/SATA
• Any: AnyBay
• S: standard
• P: performance
• NA: not applicable
• Y: yes
• Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger
capacity NVMe drive is installed)
• Y* in the Support DIMMs >= 96 GB column: yes (when no ThinkSystem 96GB TruDDR5 4800MHz (2Rx4)
RDIMM-A or ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM-A v1 is installed)
• N: no
Processor groups are defined as follows:
• Group B: 200 W ≤ cTDP ≤ 240 W
• Group A: 240 W < cTDP ≤ 300 W
• Group E: 320 W ≤ cTDP ≤ 400 W
Typical configurations
This section provides thermal information for typical configurations.
Front bays Max. Temp.
45°C
35°C
• 8 x 2.5"
• 16 x 2.5"
• 8 x 3.5"
30°C
25°C
Notes:
• Group E 1 processors include 9654(P), 9554(P), 9174F, 9754, and 9734.
• When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the
ambient temperature must be limited to 30°C or lower.
• When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
– Broadcom 57416 10GBASE-T 2-port OCP
– Broadcom 57454 10GBASE-T 4-port OCP
– Network interface cards (NICs) at a rate greater than or equal to 100 GB
– Parts with AOC and at the rate of 25 GB
Processor Heat sink
Group B
2U P
Group B
2U S
Group B, A
2U S
Group B, A
2U S
Group E 1
2U P
Group E
2U P
Fan type
Air baffle
S P
S S
S P
S P
S P
S P
.
Chapter 5 Hardware replacement procedures
Support
DIMMs >= 96
GB
N
N
Y
Y
Y*
Y
59