Toshiba TLCS-900/H1 Series Manual page 468

4. Electrical Characteristics
4.1 Absolute Maximum Ratings
Power Supply Voltage
Input Voltage
Output Current
Output Current (MX, MY pin)
Output Current
Output Current (PX, PY pin)
Output Current (Total)
Output Current (Total)
Power Dissipation (Ta = 85°C)
Soldering Temperature (10 s)
Storage Temperature
Operation Temperature
Note: The absolute maximum ratings are rated values which must not be exceeded
Solderability
Test Test condition
parameter
Solderability (1) Use of Sn-37Pb solder Bath
(2) Use of Sn-3.0Ag-0.5Cu solder bath
Parameter Symbol
Σ I
T
SOLDER
T
T
during operation, even for an instant. Any one of the ratings must not be
exceeded. If any absolute maximum rating is exceeded, the device may break
down or its performance may be degraded, causing it to catch fire or explode
resulting in injury to the user. Thus, when designing products which include this
device, ensure that no absolute maximum rating value will ever be exceeded.
Solder bath temperature =230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Solder bath temperature =245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Rating
−0.5 to 4.0
V
CC
−0.5 to VCC + 0.5
V
IN
I 2
OL
I 15
OL
−2
I
OH
−15
I
OH
Σ I
80
OL
−80
OH
P 600
D
260
−65 to 150
STG
−20 to 70
OPR
92CH21-466
TMP92CH21
Unit
V
V
mA
mA
mA
mA
mA
mA
mW
°C
°C
°C
Note
Pass:
solderability rate until forming ≥ 95%
2009-06-19