Heat Dissipation System; Technical Specifications - Huawei USG6000 Series Hardware Manual

HUAWEI USG6000 Series
Hardware Guide

2.1.6.5 Heat Dissipation System

The USG6310/6320 has a built-in fan module for heat dissipation.
The device adopts the automatic fan speed adjustment technology to monitor the temperature
of key components. If the internal device temperature is higher than the specified value, the
fan speed increases; when the temperature falls back to its normal range, the fan speed
decreases. In this way, the fan module enables the device to run in normal temperature,
ensuring device running security and reliability.
The device provides a left-to-right air flow, as shown in
locates at the air exhaust and cannot be removed.
Figure 2-25 System air flow

2.1.6.6 Technical Specifications

This section describes the dimensions, weight, and power and environment specifications of
the USG6310/6320.
Table 2-18
Table 2-18 USG6310/6320 Technical Specifications
Item
System specifications
CPU
Memory
Flash
CF card
Hard disk
SPUB (the service engine)
4G LTE Data Card
Issue 08 (2017-06-30)
C O
N S
O L
E
XX
XX XX
XX
XX XX
XX
XX
XX XX
XX
XX XX
X
1
3
5
7
S e
0 c o
s p
2
4
6
R S
T
lists the technical specifications of the USG6310/6320.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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Cool air
Description
Multi-core 1.0 GHz processor
DDR3 2 GB
16 MB
1 GB
Not supported
Not supported
Supported
2 Hardware Overview
Figure 2-25. The built-in fan module
Hot air
46