Toshiba e-STUDIO2008A Service Manual page 22

Multifunctional digital systems
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9. REPLACEMENT OF PC BOARDS/HDD ...................................................................... 9-1
9.1
Removal and Installation of PC Boards/HDD.................................................................... 9-1
9.1.1
SYS Board cover ............................................................................................... 9-1
9.1.2
SYS board ......................................................................................................... 9-1
9.1.3
Hard disk (HDD) ................................................................................................ 9-4
9.1.4
LGC board ......................................................................................................... 9-5
9.1.5
Switching regulator ............................................................................................ 9-7
9.1.6
High-voltage transformer (HVT)......................................................................... 9-8
9.1.7
FRAM <for SYS board>..................................................................................... 9-9
9.1.8
Main memory (DIMM) ........................................................................................ 9-9
9.1.9
EEPROM <for LGC board> ............................................................................. 9-10
9.2
Precautions and Procedures for Replacing PC Boards and HDD/SSD .......................... 9-11
9.2.1
Precautions when replacing PC boards........................................................... 9-11
9.2.2
HDD/SSD fault diagnosis................................................................................. 9-12
9.2.3
Precautions and procedures when replacing the HDD/SSD ........................... 9-14
9.2.4
Precautions and procedures when replacing the SYS board .......................... 9-19
9.2.5
Procedures when replacing the LGC board..................................................... 9-23
9.2.6
Procedure when replacing the battery on LGC board ..................................... 9-24
9.2.7
Procedures when replacing the SLG board
(e-STUDIO206L/256/306/356/456/506)........................................................... 9-24
9.2.8
Precautions and procedure when replacing the SRAM ................................... 9-25
9.2.9
Procedures when replacing EEPROM............................................................. 9-33
9.2.10
Firmware confirmation after the PC board/HDD/SSD replacement ................. 9-34
9.2.11
License re-registration using the one-time dongle ........................................... 9-35
9.3
Precautions for Installation of GP-1070 and Disposal of HDD/Board ............................. 9-37
9.3.1
Precautions for Installation of GP-1070 ........................................................... 9-37
9.3.2
Precautions when disposing of the HDD ......................................................... 9-37
9.3.3
Precautions when disposing of the SYS board................................................ 9-37
9.3.4
Precautions when disposing of the SRAM....................................................... 9-37
10. REMOTE SERVICE..................................................................................................... 10-1
10.1 Auto Supply Order........................................................................................................... 10-1
10.1.1
Outline ............................................................................................................. 10-1
10.1.2
Setting item...................................................................................................... 10-2
10.1.3
Setting procedure ............................................................................................ 10-4
10.1.4
Order sheet format......................................................................................... 10-13
10.2 Service Notification ....................................................................................................... 10-17
10.2.1
Outline ........................................................................................................... 10-17
10.2.2
Setting............................................................................................................ 10-18
10.2.3
Items to be notified ........................................................................................ 10-25
11. FIRMWARE UPDATING ............................................................................................. 11-1
11.1 Overview ......................................................................................................................... 11-1
11.2 Firmware Updating with USB Device .............................................................................. 11-2
11.2.1
Firmware type and data file name for updating ............................................... 11-2
11.2.2
Update procedure ............................................................................................ 11-5
11.3 Patch Updating with USB Device.................................................................................. 11-14
11.3.1
Firmware type and data file name for patch updating.................................... 11-14
11.3.2
Update procedure .......................................................................................... 11-16
11.4
When Firmware Update Failed
11.5 Flow chart for correcting USB update failure ................................................................ 11-24
11.6 Confirmation of the updated data.................................................................................. 11-27
12. BACKUP FUNCTION.................................................................................................. 12-1
12.1 Data Cloning ................................................................................................................... 12-1
12.1.1
General description.......................................................................................... 12-1
12.1.2
Precautions...................................................................................................... 12-1
12.1.3
Backup files ..................................................................................................... 12-2
12.1.4
Cloning procedure ........................................................................................... 12-2
e-STUDIO2008A/2508A/3008A/3508A/4508A/5008A
CONTENTS
................................................................................... 11-22
© 2015 TOSHIBA TEC CORPORATION All rights reserved
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