C • Appendix C: Specifications And Physical Description; Specifications; Heatsink And Conduction Plate Members; Reliability Requirements - GE OpenVPX VPXcel6 SBC622 Hardware Reference Manual

C • Appendix C: Specifications and Physical Description
C.1 Specifications
C.2 Heatsink and Conduction Plate Members
C.3 Reliability Requirements
The SBC622 assembly offers the ability of targeting multiple levels of
environmental support. The following tables list Level 1, 2, 4, and 5 support:

Table C-1 Environmental Specifications by Level

Cooling Method
Conformal Coating
High/Low Temperature
Operational
Random Vibration
Shock
* With a flat response to 1000 Hz, 6dB/Oct roll-off from 1000 to 2000 Hz
** From 10 to 1000 Hz
***Peak sawtooth 11 ms duration
The heat sink or conduction cooled plate provided for the SBC622 are required to
remove over 37 W of heat from the Core i7 processor in addition to over 40 W
combined from the remainder of the board. The thermal relief solution is
required to support the operating temperature ranges listed in Table C‐1 above,
over silicon with Tjmax ratings of 100° C.
• The SBC622 assembly has obtained CE mark.
• The SBC622 is fully compliant with the European Union RoHS and WEEE
directives.
Level 1 Level 2
Convection Convection
Optional Standard
0°C το 55°C -20°C το 65°C
(300 lfm) (300 lfm)
2 2
0.002g /Hz* 0.002g /Hz*
20g*** 20g***
Appendix C: Specifications and Physical Description 98
Level 4 Level 5
Conduction Conduction
Standard Standard
-40°C το 75°C -40°C το 85°C
at cold wall at cold wall
2 2
0.1g /Hz** 0.1g /Hz**
40g*** 40g***
.