Technical Rules; Technical Rules For Processors And Heat; Sinks - Lenovo ThinkSystem SR630 Maintenance Manual

Attention: Prevent exposure to static electricity, which might lead to system halt and loss of data, by
keeping static-sensitive components in their static-protective packages until installation, and handling these
devices with an electrostatic-discharge wrist strap or other grounding system.
• Limit your movement to prevent building up static electricity around you.
• Take additional care when handling devices during cold weather, for heating would reduce indoor
humidity and increase static electricity.
• Always use an electrostatic-discharge wrist strap or other grounding system, particularly when working
inside the server with the power on.
• While the device is still in its static-protective package, touch it to an unpainted metal surface on the
outside of the server for at least two seconds. This drains static electricity from the package and from your
body.
• Remove the device from the package and install it directly into the server without putting it down. If it is
necessary to put the device down, put it back into the static-protective package. Never place the device
on the server or on any metal surface.
• When handling a device, carefully hold it by the edges or the frame.
• Do not touch solder joints, pins, or exposed circuitry.
• Keep the device from others' reach to prevent possible damages.

Technical rules

Refer to the below technical rules and limitations when you install the related server components.
Technical rules for processors and heat sinks
Understanding the technical rules helps you choose the correct heat sinks, fans, and other components
based on what processors are configured for your server.
Processor quantity rules
Two CPUs and eight fans are required if your server is installed with any of the following:
• More than four NVMe SSDs (including EDSFF drives but excluding 7mm drives) connected to the front
and rear backplanes
• Rear 2.5-inch NVMe SSD (excluding 7mm drive)
• 16-EDSFF drive backplane
• CFF HBA/RAID adapter used together with the 6 SATA/SAS + 4 Anybay backplane
• ThinkSystem Mellanox HDR/200GbE 2x PCIe Aux Kit
Processor TDP rules
The following lists the TDP rules for different configurations.
Table 35. Processor TDP rules for different configurations
Configuration
GPU adapter with 4 x 2.5''
SAS/SATA drive backplane
used
10 x 2.5'' AnyBay drive
backplane or 16-EDSFF drive
backplane
ThinkSystem SR630 V2 Maintenance Manual
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Max. ambient temperature
Max. TDP
270 W
Refer to the "Environment" section in
"Specifications" on page 2.
250 W