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d.
Insert the leads of the new component into and through the drilled hole or eyelet,
clip off excess wire, and solder from the etched circuit side of the PAC.
e.
Examine the PAC carefully for excess solder.
Remove resin deposits with a
commercial cleaning solvent.
Wipe the PAC clean with a dry lint-free cloth.
Maintenance Inspection
Conduct a visual inspection periodically.
Watch specifically for accumulations of
dust and dirt, improperly seated PACs, and damaged or improperly dressed cable and sig-
nal leads.
Check that all connectors are securely mated, all air barriers are in place, and
all cooling fans are operating.
COMPUTER SYSTEM PREVENTIVE MAINTENANCE
Clean the air filters on a 2 to 4 week basis, depending on the dust content of the
surrounding air.
If
the dust content is severe, daily inspection is recommended.
The
filters can be cleaned by immersion in soap and water.
COMPUTER SYSTEM TROUBLESHOOTING
Computer system troubleshooting procedures include electrical and mechanical in-
spection, power supply troubleshooting, and logic PAC substitution.
Corrective Maintenance Inspection
Before begmning troubleshooting procedures, a thorough inspection of the system
should be performed.
Check that the system is not physically damaged and that no wires
have been torn accidentally from the equipment.
Make sure that electrical connectors and
PACs fit firmly in their sockets.
Maintenance for the computer system consists largely of conducting prescribed
diagnostic routines in conjunction with the controls on the Control Panel to localize equip-
ment malfunctions.
The indications provided on the Control Panel will help locate the
trouble areas within the system.
PAC Substitution
Replacing suspected packages with those known to be operating properly is the
quickest procedure for logic circuit troubleshooting.
Troubleshooting at this level is best
accomplished with a thorough rmderstanding of principles of operation, and with the use of
all other aids, such as the flow charts and instruction analyses in Volume II, the logic
diagrams in Volume Ill, and the circuit descriptions in Appendix A of this manual.
Faulty packages can be repaired by referring to the appropriate PAC circuit
description, schematic, and assembly drawing, and then isolating and replacing the faulty
component(s) by using the list of replaceable parts.
3-3
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