Figure 10: Heat Sink Diagram For Air Cooled Versions (1-,2-,3-,4-Style) - GE CM6 Hardware Reference Manual

Single/dual core powerpc 3u compactpci sbc fourth edition
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80
70
60
50
40
0,5

Figure 10: Heat sink diagram for air cooled versions (1-,2-,3-,4-style)

GE Intelligent Platforms – CM6 Hardware Reference Manual, Fourth Edition
1
1,5
2
diagram is for typical power consumption, with both Gigabit links up and
without a mounted PMC card
0 m/s airflow means convection cooled only
The core temperature of the CPU can be read out via the onboard
temperature sensor. The value must be kept below 105 °C for all operating
conditions. This value is already included in the airspeed diagram above.
Table 30: Maximal card edge temperature for conduction cooled version
CM6
CM6 Dual
1000MHz DDR400/1 GB
typical power consumption, with both Gigabit links up and without a
mounted PMC card
the maximal card edge is defined if CPU core temperature reaches 105°C
please see CM6 thermal report for more information
2,5
3
3,5
(8-style)
Maximal Card Edge Temperature
73°C
CM6
1000/1333MHz Dual
1000MHz LV Dual
1000MHz LV Single
Airspeed m/s
Page 68

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