Reflow Profile - Huawei MU509-65 HSDPA Hardware Manual

HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide

6.8.3 Reflow Profile

The LGA module must be reflowed on the top side of customer's development board.
For the soldering temperature of the LGA module, see the following figure.
Figure 6-9 Reflow profile
° C
300
240
217
180
165
120
60
Table 6-2 Reflow parameters
Temperature Zone
Preheat zone
(40° C–165° C)
Soak zone
(165° C–217° C)
Reflow zone (> 217° C)
Cooling zone
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60s~100s
Time
/
(t1–t2): 60s–100s
(t3–t4): 45s–80s
Cooling rate: 2°C/s ≤ Slope ≤ 5° C/s
Mechanical Specifications
235° C<Tmax<245° C
45s~80s
Key Parameter
Heating rate: 0.5° C/s–2° C/s
/
Peak reflow temperature:
235° C–245° C
s
64