Reflow Profile - Huawei MC509 Series Hardware Manual

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide
Figure 6-6 Recommended stencil design of LGA module

6.9.3 Reflow Profile

For the soldering temperature of the LGA module, see the following figure.
Issue 02 (2013-05-06)
PCB PADS
Stencil design
Unit: mm
The stencil design has been qualified for HUAWEI mainboard assembly, customers can adjust
the parameters by their motherboard design and process situation to assure LGA soldering
quality and no defect.
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Mechanical Specifications
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