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HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
6.9 Rework
6.9.1 Process of Rework
Preparation
Remove
obstacles
Place
the PCB
6.9.2 Preparations of Rework
6.9.3 Removing of the Module
The solder is molten and reflowed through heating during the module removing
process. The heating rate must be quick but controllable in order to melt all the solder
joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,
and their solder joints against heating or mechanical damages.
Figure 6-10 Equipment used for rework
Issue 01 (2016-04-08)
Component
disassembly
Select tools
Set temperature
Apply flux
Heat and
disassemble
Cool the PCB
Remove barrier or devices that cannot stand high temperature before rework.
If the device to be reworked is beyond the storage period, bake the device
according to Table 6-1 .
The LGA module has many solder pads and the pads are large. Therefore, common
soldering irons and heat guns cannot be used in the rework. Rework must be done using
either infrared heating rework stations or hot air rework stations. Infrared heating rework
stations are preferred, because they can heat components without touching them. In
addition, infrared heating rework stations produce less solder debris and less impact on
modules, while hot air rework stations may cause shift of other components not to be
reworked.
You must not reuse the module after disassembly from PCB during rework.
It is proposed that a special clamp is used to remove the module.
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Soldering
Component
area handing
installation
Check components
Remove debris
Process the solder
Align components
pad
Heat and solder
Apply solder paste
Remove debris
Mechanical Specifications
Installation
Functional
inspection
test
Check solder points
Verify the
rework
Check around
soldering area
Inspect
appearance
Reassemble other
components
65
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