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HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
Pin
Pin Name
No.
114
GND
115
NC
116
GND
117
NC
118
NC
119
NC
120
NC
121
GND
122
GND
123
GND
124
GND
125
GND
126
GND
127
GND
128
GND
129
GND
130
GND
131
GND
132
GND
133
GND
Issue 01 (2016-04-08)
Pad
Description
Type
Purpose I/O pin
-
Ground
-
Not connected
-
Ground
-
Not connected
-
Not connected
-
Not connected
-
Not connected
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
Min.
Typ.
Parameter
(V)
(V)
V
0
-
OL
V
1.69
2.6
IH
–0.3
V
-
IL
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max.
Comments
(V)
of these
0.45
pins has not
been
2.9
defined.
0.91
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
20
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