Huawei MU509 Manual
Hsdpa module
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Also See for MU509:
- At command interface specification (227 pages) ,
- Hardware manual (94 pages) ,
- Hardware migration manual (70 pages)
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Copyright © Huawei Technologies Co., Ltd. 2010.
All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any
means without prior written consent of Huawei Technologies Co., Ltd.
The product described in this manual may include copyrighted software of Huawei
Technologies Co., Ltd and possible licensors. Customers shall not in any manner
reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse
engineer, lease, assign, or sublicense the said software, unless such restrictions
are prohibited by applicable laws or such actions are approved by respective
copyright holders under licenses.
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Technologies Co., Ltd.
Other trademarks, product, service and company names mentioned are the
property of their respective owners.
Notice
Some features of the product and its accessories described herein rely on the
software installed, capacities and settings of local network, and may not be
activated or may be limited by local network operators or network service
providers, thus the descriptions herein may not exactly match the product or its
accessories you purchase.
Huawei Technologies Co., Ltd reserves the right to change or modify any
information or specifications contained in this manual without prior notice or
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Summary of Contents for Huawei MU509
- Page 1 No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. The product described in this manual may include copyrighted software of Huawei Technologies Co., Ltd and possible licensors. Customers shall not in any manner...
- Page 2 RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR ANTICIPATED SAVINGS.
- Page 3 Contents Getting to Know the MU509..............1 PCB Design ................... 3 Assembly....................5...
- Page 4 This manual briefly describes the preparation, the process for PCB Design, Assembly and safety precautions. You are recommended to read the manual before using the MU509. Getting to Know the MU509 The package of the LGA module is 116 pin LGA with a dimension of 30 mm × 30 mm ×...
- Page 6 PCB Design CB Pad Design To achieve high efficiency of the production and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: the size of the middle region is the same as the pad size of the product package; other pads are 0.05 mm larger than the unilateral pad of the product package.
- Page 7 Requirements on PCB Layout Other devices must be located more than 3 mm away from the LGA module. It is recommended to be 5 mm. The minimum distance between the LGA module and the PCB edge is 1.5 mm. When the PCB layout is double sided, it is recommended that the LGA module be placed on the second side for assembly.
- Page 8 Design of Solder Mask The PCB pad design can be solder mask defined (SMD), or non-solder mask defined (NSMD). NSMD is recommended. In addition, the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved. The solder mask must be 100 um to150 um larger than the pad, that is, the single side of the solder mask must be 50 um to 75 um larger than the pad.
- Page 9 Reflow Profile For the soldering temperature of the LGA module, see the following figure:...
- Page 10 Reflow parameters: Preheat zone Heating rate: 0.5–2°C/sec Time: 60–120sec (40–150°C) Soak zone Heating rate: <1.0°C/sec Time: 60–120sec (150-200°C) Reflow zone (> Peak reflow temperature: Time: 30–90sec 217°C) 230–260°C Cooling zone Cooling rate: 1°C/sec ≤ Slope ≤ 4°C/sec...