Huawei MU509-65 HSDPA Hardware Manual page 5

HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
4 RF Specifications ......................................................................................................................... 44
4.1 About This Chapter ......................................................................................................................... 44
4.2 Operating Frequencies ................................................................................................................... 44
4.3 Conducted RF Measurement ......................................................................................................... 44
4.3.1 Test Environment ................................................................................................................... 44
4.3.2 Test Standards ....................................................................................................................... 45
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 45
4.4.1 Conducted Receive Sensitivity .............................................................................................. 45
4.4.2 Conducted Transmit Power ................................................................................................... 45
4.5 Antenna Design Requirements ...................................................................................................... 46
4.5.1 Antenna Design Indicators .................................................................................................... 46
4.5.2 Interference ........................................................................................................................... 47
4.5.3 Antenna Requirements .......................................................................................................... 47
5 Electrical and Reliability Features ........................................................................................... 48
5.1 About This Chapter ......................................................................................................................... 48
5.2 Absolute Ratings ............................................................................................................................ 48
5.3 Operating and Storage Temperatures ............................................................................................ 49
5.4 Power Supply Features .................................................................................................................. 49
5.4.1 Input Power Supply ............................................................................................................... 49
5.4.2 Power Consumption .............................................................................................................. 50
5.5 Reliability Features ......................................................................................................................... 51
5.6 EMC and ESD Features ................................................................................................................. 53
6 Mechanical Specifications ......................................................................................................... 56
6.1 About This Chapter ......................................................................................................................... 56
6.2 Storage Requirement ..................................................................................................................... 56
6.3 Moisture Sensitivity ........................................................................................................................ 56
6.4 Dimensions ..................................................................................................................................... 57
6.5 Packaging ....................................................................................................................................... 57
6.6 Customer PCB Design ................................................................................................................... 60
6.6.1 PCB Surface Finish ............................................................................................................... 60
6.6.2 PCB Pad Design .................................................................................................................... 60
6.6.3 Solder Mask ........................................................................................................................... 60
6.6.4 Requirements on PCB Layout ............................................................................................... 60
6.7 Thermal Design Solution ................................................................................................................ 61
6.8 Assembly Processes ...................................................................................................................... 63
6.8.1 Overview ................................................................................................................................ 63
6.8.2 Stencil Design ........................................................................................................................ 63
6.8.3 Reflow Profile ........................................................................................................................ 64
6.9 Rework ........................................................................................................................................... 65
6.9.1 Process of Rework ................................................................................................................ 65
6.9.2 Preparations of Rework ......................................................................................................... 65
Issue 01 (2016-04-08)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Contents
5