Reflow Profile - Huawei MU509 Series Hardware Manual
Hsdpa lga module
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Also See for MU509 Series:
- At command interface specification (227 pages) ,
- Hardware migration manual (70 pages) ,
- Development kit manual (35 pages)
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HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
Figure 6-5 Recommended stencil design of LGA module
6.8.3 Reflow Profile
For the soldering temperature of the LGA module, see the following figure.
Issue 09 (2014-03-06)
PCB PADS
Stencil design
Unit: mm
The stencil design has been qualified for HUAWEI mainboard assembly, customers can adjust
the parameters by their motherboard design and process situation to assure LGA soldering
quality and no defect.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Process Design
81
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