Reflow Profile - Huawei ME909 Series Hardware Manual

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Figure 6-5 Recommended stencil design of LGA module (unit: mm)

6.8.3 Reflow Profile

For the soldering temperature of the LGA module, see the following figure.
Issue V0.3 (2013-05-21)
The stencil design has been qualified for HUAWEI motherboard assembly, customers can
adjust the parameters by their motherboard design and process situation to assure LGA
soldering quality and no defect.
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Mechanical Specifications
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