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Copyright © Huawei Technologies Co., Ltd. 2012.
All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means
without prior written consent of Huawei Technologies Co., Ltd.
The product described in this manual may include copyrighted software of Huawei
Technologies Co., Ltd and possible licensors. Customers shall not in any manner reproduce,
distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign,
or sublicense the said software, unless such restrictions are prohibited by applicable laws or
such actions are approved by respective copyright holders under licenses.
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are trademarks or registered trademarks of Huawei
Technologies Co., Ltd.
Other trademarks, product, service and company names mentioned are the property of their
respective owners.
Notice
Some features of the product and its accessories described herein rely on the software
installed, capacities and settings of local network, and may not be activated or may be
limited by local network operators or network service providers, thus the descriptions herein
may not exactly match the product or its accessories you purchase.
Huawei Technologies Co., Ltd reserves the right to change or modify any information or
specifications contained in this manual without prior notice or obligation.
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Summary of Contents for Huawei MU709Gs-8
- Page 1 Huawei Technologies Co., Ltd reserves the right to change or modify any information or specifications contained in this manual without prior notice or obligation.
- Page 2 FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR ANTICIPATED SAVINGS.
- Page 3 Contents Getting to Know the MU709 ........................... 1 PCB Design ................................2 Assembly................................3...
- Page 4 Thank you for purchasing HUAWEI MU709Gs-8 HSPA+ LGA Module (hereinafter referred to as the MU709) Note: This manual briefly describes the preparation, the process for PCB Design, Assembly and safety precautions. You are recommended to read the manual before using the MU709.
- Page 5 PCB Design PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: the sizes of the solder pads on customers' PCBs are the same as those of the module's solder pads for the high production efficiency and high reliability of solder joints.
- Page 6 Requirements on PCB Layout To reduce deformation, a thickness of at least 1.0 mm is recommended. Other devices must be located more than 3 mm (5 mm recommended) away from the LGA module. The minimum distance between the LGA module and the PCB edge is 0.5 When the PCB layout is double sided, it is recommended that the LGA module be ...
- Page 8 Reflow Profile For the soldering temperature of the LGA module, see the following figure. Reflow profile Reflow parameters Temperature Zone Time Key Parameter Preheat zone (40°C–150°C) 60s–120s Heating rate: 0.5°C/s–2°C/s...
- Page 9 Soak zone (t1–t2): 60s–120s Heating rate: < 1.0°C/s (150°C–200°C) Reflow zone (> 217°C) (t3–t4): 30s–90s Peak reflow temperature: 230°C–250°C Cooling zone Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s...