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HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
6.4 Dimensions
Figure 6-1 shows the dimensions of the module in details.
Figure 6-1 Dimensions (Unit: mm)
Top view
6.5 Packaging
HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons. The tray specification complies with Jedec_Tray_DGuide4-10D.
Issue 01 (2016-04-08)
Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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Mechanical Specifications
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