Assembly Processes; Overview; Stencil Design - Huawei MU509-65 HSDPA Hardware Manual

Lga module

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HUAWEI MU509-65 HSDPA LGA Module

Hardware Guide

6.8 Assembly Processes

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It is recommended that the stencil for the LGA module be 0.12 mm in thickness. For

the stencil design, see the following figure.

Figure 6-8 Recommended stencil design of LGA module (Unit: mm)

Issue 01 (2016-04-08)

Tray modules are required at SMT lines, because LGA modules are placed on

ESD pallets.

Reflow ovens with at least seven temperature zones are recommended.

Use reflow ovens or rework stations for soldering, because LGA modules have

large solder pads and cannot be soldered manually.

The stencil design has been qualified for HUAWEI main board assembly, customers can adjust

the parameters by their motherboard design and process situation to assure LGA soldering

quality and no defect.

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Mechanical Specifications

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