Huawei MU509-65 HSDPA Hardware Manual page 62

HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
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Figure 6-6 Adding heat sink to the module for optimal heat dissipation
Shielding case
Module PCB
Shielding case
Module PCB
Figure 6-7 Adding enclosure to enhance the heat dissipation of the module
Shielding case
Module PCB
Customer PCB
Customer PCB
Issue 01 (2016-04-08)
The recommended thermal conductivity of the thermal conductive material is
1.0 W/m-k or higher (recommended manufacturers: Laird or Bergquist).
Conductive material should obey the following rule: after the heat sink is
fastened to the shielding case, the compression amount of the thermal
conductive material accounts for 15% to 30% of the thermal conductive
material size.
Conductive material should be as thin as possible.
The recommended material of the enclosure is metallic materials, especially
you can add pin fin on the enclosure surface.
If the heat sink is installed above the shielding case, you should attach the
thermal conductive material between the shielding case and the heat sink; if
the heat sink is installed below the bottom side of the customer PCB, you
should attach the thermal conductive material between the customer PCB and
the heat sink, as shown in Figure 6-6 and Figure 6-7 . Preferably, we
recommend the heat sink be installed below the bottom side of the customer
PCB.
Use more pin fins to enlarge heat dissipation area.
Shielding case
Module PCB
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Copyright © Huawei Technologies Co., Ltd.
Mechanical Specifications
Heat sink
Conductive material
Customer PCB
Customer PCB
Conductive material
Heat sink
Enclosure
Conductive material
Heat sink
Heat sink
Conductive material
Enclosure
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