Huawei MU509-65 HSDPA Hardware Manual page 52

HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
Item
Low-temperature
operating
High-temperature
operating
Temperature
cycle operating
Damp heat
cycling
Thermal shock
Salty fog test
Issue 01 (2016-04-08)
Test Condition
Temperature: –40º C

 Operation mode: working
with service connected

Test duration: 24 h
 Temperature: 85º C

Operation mode: working
with service connected
 Test duration: 24 h
 High temperature: 85º C
 Low temperature: -40º C
 Operation mode: working
with service connected

Test duration: 30 cycles;1
h+1h /cycle

High temperature: 55º C
 Low temperature: 25º C
 Humidity: 95%± 3%
 Operation mode: working
with service connected
 Test duration: 6 cycles;
12 h+12 h/cycle
Low temperature: –40º

 High temperature: 85º C
 Temperature change
interval: < 30s
 Operation mode:
power

Test duration: 100 cycles;
15 min+15 min/cycle
 Temperature: 35° C
 Density of the
solution: 5%± 1%

Operation mode:
power, no package
 Test duration:
Spraying interval: 8 h
Exposing period
removing the salty fog
environment: 16 h
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
Standard Sample
size
IEC6006 3 pcs/group
8-2-1
JESD22- 3 pcs/group
A108-C
JESD22- 3 pcs/group
A105-B
JESD22- 3 pcs/group
A101-B
JESD22- 3 pcs/group
A106-B
no
JESD22- 3 pcs/group
A107-B
NaCl
no
after
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
52