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HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
Pin
Pin Name
No.
134
GND
135
GND
136
GND
137
GND
138
GND
139
GND
140
GND
141
GND
142
GND
143
GND
144
GND
145
GND
Issue 01 (2016-04-08)
Pad
Description
Type
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
[1] The MU509-65 module can be used instead of MU509-c module in old devices directly
without changing the pads of the old ones. It is recommended that the new devices would
be designed based on the new pads. For details, see "Antenna Interface Compatibility
Design" in
HUAWEI 30 mm x 30 mm LGA Module Hardware Migration
I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates
power input pins; PO indicates power output pins.
V
indicates Low-level Input voltage; V
IL
Low-level Output voltage; V
The NC (Not Connected) pins are floating and there are no signal connected to these pins.
The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact us for more details about this
information.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
Min.
Parameter
(V)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
indicates High-level Input voltage; V
IH
indicates High-level Output voltage.
OH
Typ.
Max.
Comments
(V)
(V)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Guide.
indicates
OL
21
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