Reflow Profile - Huawei ME909u-521 Hardware Manual

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide

6.9.3 Reflow Profile

For the soldering temperature of the LGA module, see the following figure.
Figure 6-8 Reflow profile
° C
300
240
217
180
165
120
60
Table 6-2 Reflow parameters
Temperature Zone
Preheat zone
(40° C–165° C)
Soak zone
(165° C–217° C)
Reflow zone (> 217° C)
Cooling zone
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60s~100s
Time
-
(t1–t2): 60s–100s
(t3–t4): 45s–80s
Cooling rate: 2°C/s ≤ Slope ≤ 5° C/s
Mechanical Specifications
235° C<Tmax<245° C
45s~80s
Key Parameter
Heating rate: 0.5° C/s–2° C/s
-
Peak reflow temperature:
235° C–245° C
s
78