Huawei FusionModule2000 Product Description page 94

Smart modular data center
Hide thumbs Also See for FusionModule2000:
Table of Contents

Advertisement

FusionModule2000 Smart Modular Data Center
Product Description (380 V)
Figure 3-65 ECC800 main control module (side view)
(1) SIM card slot
ECC800 Specifications
Table 3-50 ECC800 environmental specifications
Item
Working temperature
Storage temperature
Relative humidity
Altitude
Table 3-51 ECC800 structural specifications
Item
Dimensions (L x W x H)
Color
Installation
Environmental protection
MTBF
Issue 04 (2017-06-30)
Specifications
–20° C to +50° C
–40° C to +70° C
5%–95% RH (non-condensing)
0–4000 m (When the altitude is between 3000 m and 4000 m,
the temperature decreases by 1° C for each additional 200 m.)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
(2) Micro-SD card slot
Specifications
442 mm x 330 mm x 43.6 mm
Black
Installed in a standard 1 U cabinet
Installed in a 19-inch rack
RoHS5
500,000 hours
3 System Architecture
87

Advertisement

Table of Contents
loading

Table of Contents