Process Design; About This Chapter; Storage Requirement; Moisture Sensitivity - Huawei MU509 Series Hardware Manual

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide

6.1 About This Chapter

This chapter describes the process design and mechanical specifications:
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6.2 Storage Requirement

The module must be stored and sealed properly in vacuum package under a
temperature below 40°C and the relative humidity less than 90% in order to ensure
the weldability within 12 months.

6.3 Moisture Sensitivity

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Table 6-1 Baking parameters
Baking Temperature
125°C±5°C
Issue 09 (2014-03-06)
Storage Requirement
Moisture Sensitivity
Dimensions and interfaces
Packaging
Label
Customer PCB Design
Assembly Processes
Specification of Rework
The moisture sensitivity is level 3.
After unpacking, the module must be assembled within 168 hours under the
environmental conditions that the temperature is lower than 30°C and the relative
humidity is less than 60%. If the preceding conditions cannot be met, the module
needs to be baked according to the parameters specified in Table 6-1 .
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6
Baking Condition
Relative humidity ≤ 60%

Process Design

Process Design
Baking Duration
8 hours
Remarks
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