Huawei MU509 Series Hardware Manual page 9

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
3.10 JTAG Interface ............................................................................................................................. 47
3.11 RF Antenna Interface.................................................................................................................... 48
3.12 NC Pins ........................................................................................................................................ 48
4 RF Specifications ......................................................................................................................... 49
4.1 About This Chapter ......................................................................................................................... 49
4.2 Antenna Installation Guidelines ...................................................................................................... 49
4.3 Operating Frequencies ................................................................................................................... 49
4.4 Conducted RF Measurement ......................................................................................................... 50
4.4.1 Test Environment ................................................................................................................... 50
4.4.2 Test Standards ....................................................................................................................... 50
4.5 Conducted Rx Sensitivity and Tx Power ........................................................................................ 50
4.5.1 Conducted Receive Sensitivity .............................................................................................. 50
4.5.2 Conducted Transmit Power ................................................................................................... 51
4.6 Antenna Design Requirements ...................................................................................................... 52
4.6.1 Antenna Design Indicators..................................................................................................... 52
4.6.2 Interference ........................................................................................................................... 53
4.6.3 GSM/WCDMA Antenna Requirements .................................................................................. 54
4.6.4 Radio Test Environment ........................................................................................................ 54
5 Electrical and Reliability Features ........................................................................................... 56
5.1 About This Chapter ......................................................................................................................... 56
5.2 Extreme Operating Conditions ....................................................................................................... 56
5.3 Operating and Storage Temperatures and Humidity ...................................................................... 57
5.4 Electrical Features of Application Interfaces .................................................................................. 57
5.5 Power Supply Features .................................................................................................................. 58
5.5.1 Input Power Supply ............................................................................................................... 58
5.5.2 Power Consumption .............................................................................................................. 59
5.6 Reliability Features ......................................................................................................................... 69
5.7 EMC and ESD Features ................................................................................................................. 71
6 Process Design ............................................................................................................................. 74
6.1 About This Chapter ......................................................................................................................... 74
6.2 Storage Requirement ..................................................................................................................... 74
6.3 Moisture Sensitivity ........................................................................................................................ 74
6.4 Dimensions and interfaces ............................................................................................................. 75
6.5 Packaging ....................................................................................................................................... 76
6.6 Label ............................................................................................................................................... 77
6.7 Customer PCB Design ................................................................................................................... 79
6.7.1 PCB Surface Finish ............................................................................................................... 79
6.7.2 PCB Pad Design .................................................................................................................... 79
6.7.3 Solder Mask ........................................................................................................................... 79
6.7.4 Requirements on PCB Layout ............................................................................................... 80
6.8 Assembly Processes ...................................................................................................................... 80
Issue 09 (2014-03-06)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Contents
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