HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
PIN
Pin Name
No.
Normal
115
NC
116
GND
117
NC
118
NC
119
NC
120
NC
121
GND
122
GND
123
GND
124
GND
125
GND
126
GND
127
GND
128
GND
129
GND
130
GND
131
GND
132
GND
133
GND
134
GND
135
GND
136
GND
137
GND
138
GND
139
GND
140
GND
141
GND
Issue 09 (2014-03-06)
I/O
Description
MUX
-
-
Not connected, please
keep this pin open.
-
-
Ground
Not connected, please
-
-
keep this pin open.
-
-
Not connected, please
keep this pin open.
-
-
Not connected, please
keep this pin open.
Not connected, please
-
-
keep this pin open.
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
DC Characteristics (V)
Min.
Typ.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
24