Reliability Features - Huawei MU509 Series Hardware Manual

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide

5.6 Reliability Features

Table 5-13 lists the test conditions and results of the reliability of the MU509 module.
Table 5-13 Test conditions and results of the reliability of the MU509 module
Item
Low-temperature
storage
High-temperature
storage
Low-temperature
operating
Stress
High-temperature
operating
Temperature
cycle operating
Issue 09 (2014-03-06)
All power consumption test configuration can be referenced by GSM Association Official
Document TS.09: Battery Life Measurement and Current Consumption Technique.
Test condition: For max. Tx power, see 4.5.2 Conducted Transmit Power, which are listed

in Table 4-3 ; for max. data throughput, see 2.2 Function Overview, which are listed in Table
2-1 .
Test Condition
 Temperature: –40ºC
 Operation mode: no
power, no package
 Test duration: 24 h

Temperature: 85ºC
 Operation mode: no
power, no package

Test duration: 24 h

Temperature: –40ºC
 Operation mode: working
with service connected

Test duration: 24 h
 Temperature: 85ºC

Operation mode: working
with service connected
 Test duration: 24 h
 High temperature: 85ºC

Low temperature: -40ºC
 Operation mode: working
with service connected

Test duration: 30 cycles;1
h+1h /cycle
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Electrical and Reliability Features
Standard Sample
size
JESD22- 3 pcs/group
A119-C
JESD22- 3 pcs/group
A103-C
IEC6006 3 pcs/group
8-2-1
JESD22- 3 pcs/group
A108-C
JESD22- 3pcs/group
A105-B
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
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