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Copyright © Huawei Technologies Co., Ltd. 2012.
All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means
without prior written consent of Huawei Technologies Co., Ltd.
The product described in this manual may include copyrighted software of Huawei
Technologies Co., Ltd and possible licensors. Customers shall not in any manner reproduce,
distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign,
or sublicense the said software, unless such restrictions are prohibited by applicable laws or
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Technologies Co., Ltd.
Other trademarks, product, service and company names mentioned are the property of their
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Notice
Some features of the product and its accessories described herein rely on the software
installed, capacities and settings of local network, and may not be activated or may be
limited by local network operators or network service providers, thus the descriptions herein
may not exactly match the product or its accessories you purchase.
Huawei Technologies Co., Ltd reserves the right to change or modify any information or
specifications contained in this manual without prior notice or obligation.
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THE CONTENTS OF THIS MANUAL ARE PROVIDED "AS IS". EXCEPT AS REQUIRED BY
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Summary of Contents for Huawei MU609T
- Page 1 Huawei Technologies Co., Ltd reserves the right to change or modify any information or specifications contained in this manual without prior notice or obligation.
- Page 2 FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR ANTICIPATED SAVINGS.
- Page 3 Contents Getting to Know the MU609T ........................1 PCB Design ................................3 Assembly................................5...
- Page 4 This manual briefly describes the preparation, the process for PCB Design, Assembly and safety precautions. You are recommended to read the manual before using the MU609T. Getting to Know the MU609T The package of the LGA module is 140 pin LGA with a dimension of 40 mm × 40 mm ×...
- Page 5 97X1.8 3X0. 6 3.25 7.32 135! 1 8. 54 29.26 35.56 4X2.0 35X3.0 Bottom view...
- Page 6 PCB Design PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: the sizes of the solder pads on customers' PCBs are the same as those of the module's solder pads for the high production efficiency and high reliability of solder joints.
- Page 7 Top view (PCB pad is recommended) 36.65 1442.8 35.56 1400 30.14 1186.8 29.26 1152 2.44 3.71 18.54 24.38 3.25 7.32 9.76 14.64 3.05 2.03 1.22 1.83 1.02 0.61...
- Page 8 Requirements on PCB Layout The thickness of PCB is more than 1.0 mm (1.2 mm recommended) to reduce the deformation caused by high temperature welding. The minimum distance between the LGA module and the PCB edge is 1.5 mm. Other ...
- Page 9 97X1.88 3X0.65 2.05 14.64 9. 7 6 3.30 7.32 3.05 1.27 1.27 2.44 3.71 18.54 24.38 29.26 30.09 35.61 36.70 4X2.08 35X3.05...
- Page 10 Item Description Figure Elongate the stencil opening 0.05 mm with the direction reverse the center of the module and add an isolation bridge with 0.2 mm width at the X axis direction. B&C 0.3 mm width stencil opening and 0.2 mm space to divide the pad with the angle of 45.
- Page 11 Reflow parameters: Temperature Zone Time Key Parameter 60s–120s Preheat zone Heating rate: (40° C–150° C) 0.5° C/s–2° C/s Soak zone (t1–t2): 60s–120s Heating rate: < 1.0° C/s (150° C–200° C) (t3–t4): 30s–90s Reflow zone (> Peak reflow 217° C) temperature: 230°...