Assembly Processes; General Description Of Assembly Processes; Stencil Design - Huawei MC509 Series Hardware Manual

Cdma lga module

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HUAWEI MC509 Series CDMA LGA Module

Hardware Guide

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6.9 Assembly Processes

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It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For

the stencil design, see the following figure:

Issue 02 (2013-05-06)

When the PCB layout is double sided, it is recommended that the LGA module

be placed on the second side for assembly; so as to avoid module dropped from

PCB or component(located in module) re-melding defects caused by uneven

weight.

Tray modules are required at SMT lines, because LGA modules are placed on

ESD pallets.

Reflow ovens with at least seven temperature zones are recommended.

Use reflow ovens or rework stations for soldering, because LGA modules have

large solder pads and cannot be soldered manually.

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Mechanical Specifications

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