Mechanical Specifications; About This Chapter; Storage Requirement; Moisture Sensitivity - Huawei MC509 Series Hardware Manual

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide

6.1 About This Chapter

This chapter describes the following aspects of the MC509 module:
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6.2 Storage Requirement

The module must be stored and sealed properly in vacuum package under a
temperature below 40º C and the relative humidity less than 90% in order to ensure
the weldability within 12 months.

6.3 Moisture Sensitivity

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Issue 02 (2013-05-06)
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Storage Requirement
Moisture Sensitivity
Dimensions and interfaces
PCB Pad Design
Packaging
Label
Customer PCB Design
Assembly Processes
Specification of Rework
The moisture sensitivity is level 3.
After unpacking, the module must be assembled within 168 hours under the
environmental conditions that the temperature is lower than 30º C and the
relative humidity is less than 60%. If the preceding conditions cannot be met, the
module needs to be baked according to the parameters specified in Table 6-1 .
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Mechanical Specifications

Mechanical Specifications
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