Pcb Pad Design; Packaging - Huawei MC509 Series Hardware Manual

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide

6.5 PCB Pad Design

To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows: the size of the pad in the middle region is
the same as the pad size of the product package; other pads are 0.05 mm larger
than the unilateral pad of the product package. For details, see Figure 6-2 .
Figure 6-2 PCB pad design

6.6 Packaging

HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons.
Issue 02 (2013-05-06)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Mechanical Specifications
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