Specifications Of Rework - Huawei MC509 Series Hardware Manual

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide

6.10.6 Specifications of Rework

Temperature parameter of rework: for either the removing or welding of the module,
the heating rate during the rework must be equal to or smaller than 3° C/s, and the
peak temperature between 240º C–250º C. The following parameters are
recommended during the rework.
Figure 6-9 Temperature graph of rework
Issue 02 (2013-05-06)
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