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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
6.3 Customer PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the customer PCB pad sizes be designed as the same as MU739's LGA pads.
For details, see Figure 6-2 .
Figure 6-2 PCB pad design
6.4 Label
The label is made from deformation-resistant, fade-resistant, and
high-temperature-resistant material and is able to endure the high temperature of
260°C.
Issue 01 (2011-08-24)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Mechanical Specifications
Unit:mm
60
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