Label; Customer Pcb Design; Pcb Surface Finish; Pcb Pad Design - Huawei MU609 Hardware Manual

HUAWEI MU609 HSPA LGA Module
Hardware Guide

6.6 Label

The label is made from deformation-resistant, fade-resistant, and
high-temperature-resistant material and is able to endure the high temperature of
260° C.
Figure 6-2 MU609 label
28mm

6.7 Customer PCB Design

6.7.1 PCB Surface Finish

The PCB surface finish recommended is Electroless Nickel, immersion Gold (ENIG).
Organic Solderability Preservative (OSP) may also be used, ENIG preferred.

6.7.2 PCB Pad Design

To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows:
Issue 04 (2016-12-12)
R=1mm
The picture mentioned above is only for reference.
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28mm
Mechanical Specifications
1.1*1.1mm
66