HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Table 6-1 Baking parameters
Baking Temperature
125° C± 5° C
6.4 Dimensions and Interfaces
Figure 6-1 shows the dimensions in details.
Figure 6-1 Dimensions (Unit: mm)
Issue 05 (2017-12-15)
Baking Condition
Relative humidity ≤ 60%
Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.
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Mechanical Specifications
Baking Duration
Remarks
8 hours
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