Packing System - Huawei MU739 Hardware Manual

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Figure 6-3 MU739 label
18.1 mm

6.5 Packing System

HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons. To get the details about the packing system, please refer to
HUAWEI LGA Module Process Design Guide.
Issue 01 (2011-08-24)
R1.0X3
28.1 mm
The picture mentioned above is only for reference.

The silk-screen should be clear, without burrs, and dimension should be accurate.

The material and surface finishing and coatings which used have to make satisfied with the

EU WEEE and RoHS directives.
The label must be heated up for 20 s~40 s and able to endure the high temperature of

260°C. And the color of the material of the nameplate can't change.
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Mechanical Specifications
1.5X1.5 mm
2 mm
5.0 mm
7 mm
61