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HUAWEI MU736 HSPA+ M.2 Module
Hardware Guide
Figure 6-3 Dimensions of label (back label)
6.4 Packing System
HUAWEI M.2 module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons.
Issue 05 (2014-01-14)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Mechanical Specifications
68
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