Huawei ME909 Series Hardware Manual page 70

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Figure 6-6 Reflow profile
Table 6-2 Reflow parameters
Temperature Zone
Preheat zone
(40° C–150° C)
Soak zone
(150° C–200° C)
Reflow zone (> 217° C)
Cooling zone
Issue V0.3 (2013-05-21)
Time
60s–120s
(t1–t2): 60s–120s
(t3–t4): 30s–90s
Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s
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Mechanical Specifications
Key Parameter
Heating rate: 0.5° C/s–2° C/s
Heating rate: < 1.0° C/s
Peak reflow temperature:
230° C–250° C
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