Packaging - Huawei ME909 Series Hardware Manual

HUAWEI ME909 Series LTE LGA Module
Hardware Guide

6.5 Packaging

HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons.
The following figure shows the packaging.
Issue V0.3 (2013-05-21)
 All materials used must meet eco-friendly requirements.
 According to the requirements and test methods specified in EIA 541, the surface resistance
must range from 10,000
 Packaging materials must be resistant to temperature higher than or equal to 150° C.
Triboelectricity must be lower than 100 V.

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to 1000,000
Mechanical Specifications
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