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Increasing Microprocessor Speed
Figure 4–1 Fan/Heat-Sink Assembly
a. Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used to improve
the thermal conductivity between the chip package and the heat sink by replac-
ing micro air pockets with a less insulative material. Perform the following
steps to position the GRAFOIL pad:
1. Perform a visual inspection of the package slug to ensure that it is free of
contamination.
2. Wearing clean gloves, pick up the GRAFOIL pad. Do not perform this
with bare hands because skin oils can be transferred to the pad.
3. Place the GRAFOIL pad on the gold-plated slug surface and align it
with the threaded studs.
Upgrading the AlphaPC 164UX
4–4
Airflow
Screw, 6-32 x 0.875 in
Qty 4
Guard, Fan
Fan
Clip, Heat Sink/Chip/Fan
Nut, Hex, 1/4-20, 2011-T3
Aluminum, 0.438 in Across
Flats, Qty 2
Torque to 20 +/- 2 in-lbs
Heat Sink, with Fan
Mounting Holes
Thermal Pad
Alpha 21164
FM-06013.AI4
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