Huawei MU709 Series Hardware Manual page 71

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
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Figure 6-5 Adding heat sink to the module for optimal heat dissipation
Figure 6-6 Adding enclosure to enhance the heat dissipation of the module
Shielding case
Module PCB
Customer PCB
Customer PCB
Issue 09 (2017-12-15)
Conductive material should be as thin as possible.
The recommended material of the enclosure is metallic materials, especially
you can add pin fin on the enclosure surface.
If the heat sink is installed above the shielding case, you should attach the
thermal conductive material between the shielding case and the heat sink; if
the heat sink is installed below the bottom side of the customer PCB, you
should attach the thermal conductive material between the customer PCB and
the heat sink, as shown in Figure 6-5 and Figure 6-6 . Preferably, we
recommend the heat sink be installed below the bottom side of the customer
PCB.
Use more pin fins to enlarge heat dissipation area.
Shielding case
Module PCB
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Mechanical Specifications
Enclosure
Conductive material
Heat sink
Heat sink
Conductive material
Enclosure
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