Huawei MU709 Series Hardware Manual page 64

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
that are not made of ESD materials must be handled with ESD treatment, such
as painting the ESD coating or ionization treatment (check that the friction voltage
is less than 100 V).

Key parts in the production equipment (parts that touch the ESD sensitive
components or parts that are within 30 cm away from the ESD sensitive
components), including the conveyor belt, conveyor chain, guide wheel, and SMT
nozzle, must all be made of ESD materials and be connected to the ground
properly (check that the friction voltage is less than 100 V).

Engineers that touch IC chips, boards, modules, and other ESD sensitive
components and assemblies must wear ESD wrist straps, ESD gloves, or ESD
finger cots properly. Engineers that sit when handling the components must all
wear ESD wrist straps.

Noticeable ESD warning signs must be attached to the packages and placement
areas of ESD sensitive components and assemblies.

Boards and IC chips must not be stacked randomly or be placed with other ESD
components.

Effective shielding measures must be taken on the ESD sensitive materials that
are transported or stored outside the EPA.
HUAWEI MU709 module does not include any protection against overvoltage.
Issue 09 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
64