Thermal Design Solution - Huawei MU709 Series Hardware Manual

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Figure 6-4 PCB Layout (Unit: mm)

6.7 Thermal Design Solution

When the module works in the maximum power condition, the module has high power
consumption (for details, see Power Consumption). To improve the module reliability
and stability, focus on the thermal design of the device to speed up heat dissipation.
For thermal characteristics of the MU709 module, you can refer to Operating and
Storage Temperatures.
Take the following heat dissipation measures:
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Issue 09 (2017-12-15)
The copper size on the PCB should be 70 mm x 70 mm or larger.
All copper ground layers of the PCB must be connected to each other through
via-holes.
Increase the quantity of the PCB ground planes.
The ground planes should be as continuous as possible.
If a fan is deployed, place the module at the cold air inlet.
Use heat sink, thermal conductive material and product enclosure to enhance the
heat dissipation of the module.
− Use anodized heat sink on the shielding case or the customer PCB on bottom
side for optimal heat dissipation. The recommended heat sink dimensions are
70 mm x 70 mm x1 mm or larger.
The material of the heat sink should adopt the higher thermal conductivity
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metallic materials, e.g. Al or Cu.
The recommended thermal conductivity of the thermal conductive material is
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1.0 W/m-k or higher (recommended manufacturers: Laird or Bergquist).
Conductive material should obey the following rule: after the heat sink is
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fastened to the shielding case, the compression amount of the thermal
conductive material accounts for 15% to 30% of the thermal conductive
material size.
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