Emc And Esd Features - Huawei MU736 Hardware Manual

HUAWEI MU736 HSPA+ M.2 Module
Hardware Guide
Item
Temperature cycle
HBM (Human
Body Model)
ESD with DVK (or
ESD
embedded in the
host)
Groups ≥ 2

5.7 EMC and ESD Features

The following are the EMC design comments:
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Issue 05 (2014-01-14)
Test Condition
High temperature:
85º C
Low temperature:
–40º C
Temperature change
slope: 6º C/min
Operation mode: no
power
Test duration: 168 h,
336 h, 500 h, 1000 h
for inspection point
1 kV (Class 1 B)
Operation mode: no
power
Contact Voltage: ± 2
kV, ± 4 kV
Air Voltage: ± 2 kV, ± 4
kV, ± 8 kV
Operation mode:
working with service
connected
Attention should be paid to static control in the manufacture, assembly, packaging,
handling, and storage process to reduce electrostatic damage to HUAWEI
module.
RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustments on RF match circuit.
TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.
TVS should be added on the SIM interface for ESD protection. The parasitic
capacitance of TVS on SIM signal should be less than 10 pF.
Resistors in parallel and a 10 nF capacitor should be added on RESET# and
Power_On_Off signal to avoid shaking, and the distance between the capacitor
and the related pin should be less than 100 mil.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
Standard Sample size
JESD22- 50
A104-C pcs/group
JESD22- 3 pcs/group
A114-D
IEC6100 2 pcs
0-4-2
Results
Visual inspection:
ok
Function test: ok
RF specification: ok
Cross section: ok
Visual inspection:
ok
Function test: ok
RF specification: ok
Visual inspection:
ok
Function test: ok
RF specification: ok
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