Card Specifications; Design Flows - Xilinx Alveo U200 User Manual

Card Specifications

Dimensions
Height: 4.376 inch (11.115 cm)
PCB thickness (±5%): 0.062 inch (0.157 cm)
Card length, passive heat sink: 9.2 inch (23.4 cm)
Card thickness with heat sink enclosure installed:
Passive: 1.44 inch (3.66 cm)
Note: A 3D model of this card is not available.
Environmental
Temperature
Operating: 0°C to +45°C
Storage: –25°C to +60°C
Humidity
10% to 90% non-condensing
Operating Voltage
PCIe ® slot +12 V

Design Flows

The preferred optimal design flow for targeting the Alveo Data Center accelerator card uses the
Vitis™ unified software platform. However, traditional design flows, such as RTL or HLx are also
supported using the Vivado
design flows.
UG1289 (v1.1.1) November 20, 2019
Alveo U200 and U250 Accelerator Cards
, +3.3 V , +3.3 V
DC DC AUXDC
® Design Suite tools. The following figure shows a summary of the
, External +12 V
DC
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Chapter 1: Introduction
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