Solder Mask; Requirements On Pcb Layout - Huawei MU609 Hardware Manual

Hspa lga module

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HUAWEI MU609 HSPA LGA Module

Hardware Guide

Figure 6-3 MU609 Footprint design (unit: mm)

6.7.3 Solder Mask

NSMD is recommended. In addition, the solder mask of the NSMD pad design is

larger than the pad so the reliability of the solder joint can be improved.

The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side

of the solder mask must be 50 µm–75 µm larger than the pad. The specific size

depends on the processing capability of the PCB manufacturer.

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Issue 04 (2016-12-12)

To reduce deformation, a thickness of at least 1.0 mm is recommended.

Other devices must be located more than 3 mm (5 mm recommended) away from

the LGA module. The minimum distance between the LGA module and the PCB

edge is 0.5 mm.

When the PCB layout is double sided, the LGA module must be placed on the

second side for assembly; so as to avoid module dropped from PCB or

component (located in module) re-melding defects caused by uneven weight.

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Mechanical Specifications

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