Huawei MU609 Hardware Manual page 6

HUAWEI MU609 HSPA LGA Module
Hardware Guide
3.12 NC Interface ................................................................................................................................ 43
4 RF Specifications ................................................................................................................. 44
4.1 About This Chapter........................................................................................................................ 44
4.2 Operating Frequencies .................................................................................................................. 44
4.3 Conducted RF Measurement ........................................................................................................ 45
4.3.1 Test Environment .................................................................................................................. 45
4.3.2 Test Standards ...................................................................................................................... 45
4.4 Conducted Rx Sensitivity and Tx Power ....................................................................................... 45
4.4.1 Conducted Receive Sensitivity ............................................................................................. 45
4.4.2 Conducted Transmit Power .................................................................................................. 46
4.5 Antenna Design Requirements ...................................................................................................... 47
4.5.1 Antenna Design Indicators .................................................................................................... 47
4.5.2 Interference .......................................................................................................................... 49
4.5.3 GSM/WCDMA/GPS Antenna Requirements ......................................................................... 49
5 Electrical and Reliability Features ..................................................................................... 51
5.1 About This Chapter........................................................................................................................ 51
5.2 Absolute Ratings ........................................................................................................................... 51
5.3 Operating and Storage Temperatures and Humidity ..................................................................... 52
5.4 Power Supply Features ................................................................................................................. 52
5.4.1 Input Power Supply............................................................................................................... 52
5.4.2 Power Consumption ............................................................................................................. 53
5.5 Reliability Features ........................................................................................................................ 58
5.6 EMC and ESD Features ................................................................................................................ 61
6 Mechanical Specifications .................................................................................................. 63
6.1 About This Chapter........................................................................................................................ 63
6.2 Storage Requirement .................................................................................................................... 63
6.3 Moisture Sensitivity ....................................................................................................................... 63
6.4 Dimensions and Interfaces ............................................................................................................ 64
6.5 Packaging ..................................................................................................................................... 64
6.6 Label ............................................................................................................................................. 66
6.7 Customer PCB Design .................................................................................................................. 66
6.7.1 PCB Surface Finish .............................................................................................................. 66
6.7.2 PCB Pad Design ................................................................................................................... 66
6.7.3 Solder Mask .......................................................................................................................... 67
6.7.4 Requirements on PCB Layout .............................................................................................. 67
6.8 Assembly Processes ..................................................................................................................... 68
6.8.1 General Description of Assembly Processes ........................................................................ 68
6.8.2 Stencil Design ....................................................................................................................... 68
6.8.3 Reflow Profile ....................................................................................................................... 69
6.9 Specification of Rework ................................................................................................................. 70
6.9.1 Process of Rework................................................................................................................ 70
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Contents
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