Artik 530S Development Kit Boot Mode Configuration; Figure 20. Location Of Boot Configuration Dip Switches On The Interposer Board - Samsung ARTIK 530s Manual

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Samsung Semiconductor, Inc.

ARTIK 530s Development Kit Boot Mode Configuration

The ARTIK 530s Interposer board contains a 4-position DIP switch that is used to select the boot source. The location
of this switch is shown in Figure 20.
The ARTIK 530s development platform provides numerous boot-up options for configuring the device. Boot devices
include a 4-GByte eMMC Flash memory device located inside the ARTIK module, as well as the microSD and USB
OTG connectors for external boot.
On initial power-up of the ARTIK platform, the eMMC memory may or may not have the latest version of the software
and hence may require an update. If an update is required, this can be accomplished by first loading the image
through either the microSD or USB OTG interfaces. The 4-position DIP switch described above is used to set the boot
priorities.
Table 9 shows the various boot options.
Table 9. Setting the Boot Priority Switches
SW402
1
2
3
4
When power is applied, the board attempts to boot from one of three primary boot options as shown in the table
above depending on the DIP switch settings. If that option is not available, it will try and boot from the next option.
This concept is shown in the table below.
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Figure 20. Location of Boot Configuration DIP Switches on the Interposer Board

eMMC Boot
OFF
OFF
X
OFF
ARTIK 530s Development Kit
SD Card Boot
OFF
OFF
X
ON
USB OTG Boot
ON
ON
X
X
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